You have not addressed the poor PCB layout where electrolytic caps are right next to heat-generating components. This for sure will negatively affect reliability, even if those caps are rated at 105°C.
Regarding "the amp doesn’t produce much heat so I suspect in the long run it won’t have a major reliability issue," that is just speculation. Have you measured the amp's efficiency at various power levels and determined the actual heat dissipation in the unvented enclosure?
Regarding "cheaper Chinese amps are a single module per channel with a small 70-100 watt power supply. This has a 1200 watt power supply," a SMPS of 1200 W is a commodity these days -- look at the more complex computer ones to start. Also these "cheaper Chinese amps" already have built-in (as opposed to external brick) SMPS of much more than 70-100 W power (e.g. see the latest
review of Aiyima A200 on ASR).
Regarding "each channel is two chips run in BTL [in parallel]," the obvious problem is that due to the very low impedance of the output stage, unless external resistors are employed, there is no reliable way to evenly distribute the load current between the two chips.
Regarding "with a BTL or bridge tied load, you double the voltage differential because the amplifier is run in differential mode. This doubles the power as each half of the amplifier is also now seeing half the impedance," this makes no electrical sense whatsoever. The chip output is differential by design, which means that each of the two output leads "sees" the entire impedance, not half of it. That is because the impedance of the sibling output lead is close to zero and negligibly small compared to that of the load. See schematics starting on p. 22 of the
application note. With the same load, a differential output doubles the voltage and quadruples the power, unless a current limit, either in the chip or PS, kicks in.